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SUPERMICRO MB 1xLGA3647, iC622, 8x DDR4 ECC,10xSATA3, 1xM.2, PCI-E 3.0/2,2,1(x16,x8,x4),2x 10Gb LAN,IPMI
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  • SUPERMICRO MB 1xLGA3647, iC622, 8x DDR4 ECC,10xSATA3, 1xM.2, PCI-E 3.0/2,2,1(x16,x8,x4),2x 10Gb LAN,IPMI

SUPERMICRO MB 1xLGA3647, iC622, 8x DDR4 ECC,10xSATA3, 1xM.2, PCI-E 3.0/2,2,1(x16,x8,x4),2x 10Gb LAN,IPMI

Formát 2280, 22110 / Rozhraní PCI-E 3.0 x4 and SATA / Účel Serverové / Počet paměťových slotů 8 / Patice procesoru LGA 3647 (Socket P) / Typ paměti DDR4

Všechny parametry
14 219 Kč
S DPH

11 751 Kč bez DPH

Momentálně nedostupné

Poptat tento produkt

Kód: MBDX11SPITFO Výrobce: Supermicro EAN: 0672042265350

Popis

Product SKUs

MBD-X11SPi-TF X11SPi-TF

Physical Stats

Form Factor ATX

Dimensions 12" x 9.6" (30.48cm x 24.38cm)

Processor/Cache

CPU 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors,
Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP

Cores / Cache Up to 28 cores

Note BIOS version 3.0a or above is required to support 2nd Generation Intel Xeon Scalable Processors-SP
BIOS version 3.2 or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R)

System Memory

Memory Capacity Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots

Memory Type 2933/2666/2400/2133MHz ECC DDR4 RDIMM, LRDIMM

DIMM Sizes RDIMM: 8GB, 16GB, 32GB, 64GB
LRDIMM: 32GB, 64GB, 128GB
3DS LRDIMM: 64GB, 128GB, 256GB

Memory Voltage 1.2V

Error Detection Corrects single-bit errors

On-Board Devices

Chipset Intel® C622

SATA Intel® C622 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10

IPMI ASPEED AST2500

Network Controllers Dual LAN with 10GBase-T with Intel® X722 + X557

Graphics Aspeed AST2500 BMC

Input / Output

SATA 10 SATA3 (6Gbps) port

LAN 2 RJ45 10GBase-T ports

USB 6 USB 2.0 ports (2 rear + 4 headers)
5 USB 3.0 ports (2 rear + 2 headers + 1 Type A)

Video Output 1 VGA port

Serial Port / Header 2 COM Ports (1 rear, 1 header)

TPM TPM Header

Expansion Slots

PCI-E 1 PCI-E 3.0 x16,
1 PCI-E 3.0 x16 (x16 or x8 ),
1 PCI-E 3.0 x8 (x0 or x8 ),
1 PCI-E 3.0 x8,
1 PCI-E 3.0 x4 (in x8 slot)

M.2 M.2 Interface: PCI-E 3.0 x4 and SATA
Form Factor: 2280, 22110
Key: M-Key
Double Height Connector

System BIOS

BIOS Type AMI UEFI

BIOS Features ACPI 6.0
RTC (Real Time Clock) Wakeup
SMBIOS 3.0 or later

Management

Software Intel® Node Manager, IPMI2.0, KVM with dedicated LAN, NMI, SPM, SUM, SuperDoctor® 5, Watchdog

Power Configurations ACPI Power Management
Power-on mode for AC power recovery

PC Health Monitoring

Voltage +1.8V, +12V, +3.3V, +5V, +5V standby, 3.3V standby, 7-fan status, Chassis intrusion header, HT, Monitors CPU voltages, Supports system management utility, VBAT

FAN 7x 4-pin fan headers (up to 7 fans), Fan speed control, Overheat LED indication, PWM fan speed control, System level control

Temperature CPU thermal trip support, PECI

LED CPU / System Overheat LED, UID/Remote UID, Suspend static indicator LED

Other Features ACPI power management, Control of power-on for recovery from AC power loss, CPU thermal trip support for processor protection, M.2 NGFF connector, RoHS, UID, WOL

Operating Environment

Operating Temperature Range 0°C ~ 50°C (32°F ~ 122°F)

Non-Operating Temperature Range -40°C - 70°C (-40°F - 158°F)

Operating Relative Humidity Range 8% - 90% (non-condensing)

Non-Operating Relative Humidity Range 5% - 95% (non-condensing)

Parts List ?

Parts List (Bulk Package)
Name Part Number Qty Description
Motherboard MBD-X11SPi-TF 1 X11SPi-TF Motherboard
I/O Cables CBL-0044L 2 57.5 cm SATA FLAT S-S PBF
I/O Shield MCP-260-00042-0N 1 STD I/O Shield for X11SPi-TF with EMI Gasket

Parts List (Retail Package)
Name Part Number Qty Description
Motherboard MBD-X11SPi-TF 1 X11SPi-TF Motherboard
QRG MNL-1900-QRG 1 Motherboard Quick Reference Guide
I/O Cables CBL-0044L 6 57.5 cm SATA FLAT S-S PBF
I/O Shield MCP-260-00042-0N 1 STD I/O Shield for X11SPi-TF with EMI Gasket

Optional Parts List
Name Part Number Qty Description
TPM security module AOM-TPM-9670H SPI capable TPM 2.0 with Infineon 9670 controller with horizontal form factor
TPM security module AOM-TPM-9670V SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor
TPM security module AOM-TPM-9671H SPI capable TPM 1.2 with Infineon 9670 controller with horizontal form factor
TPM security module AOM-TPM-9671V SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor

Chassis (Optimized for X11SPi-TF)

Embedded Compact 1U 2U 3U Mid/Mini-Tower 4U/Tower
SC813MFTQC-350CB2
SC813MFTQC-R407CB
SC113MFAC2-341CB
SC113MFAC2-R606CB
SC512F-350B1
SC113MFAC2-605CB
SC515-350
SC515-R407
SC514-R407C
SC823TQ-653LPB
SC213LT-600LPB
SC825TQC-R740LPB
SC213A-R740LPB
SC822T-333LPB
2U Heatsink:SNK-P0068APS4
SC833T-653B
2U Heatsink:SNK-P0068APS4
SC842TQC-668B

= Most optimized Chassis for SuperServer Configuration
Blue color = Compatible
Green color = Global SKU & Compatible
Red dot & green color = Optimized + Global SKU

Server (Optimized for X11SPi-TF)

Server Name

SYS-5019P-MT
SYS-5019P-MTR

Parametry

Formát2280, 22110
RozhraníPCI-E 3.0 x4 and SATA
ÚčelServerové
Počet paměťových slotů8
Patice procesoruLGA 3647 (Socket P)
Typ pamětiDDR4
Podpora ECCAno
HerníNe
Formát základní deskyATX
Počet CPU socketůSingle socket
Výrobce čipsetuIntel
ChipsetIntel C622
Maximální frekvence paměti [MHz]2933
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